True MicroLED, now broadly defined as smaller than 100-micron chiplets mass transferred onto a TFT backplane, is a disruptive technology driving a major strategic inflection point.
Over the next five years, a significant technology transition will occur shifting the DVLED industry to unpackaged variants (CoB and COG) from packaged alternatives (SMD, IMD and MiP) due to superior visual per visual performance and lower Total Cost of Ownership (TCO). By 2029, unpackaged variants will be predominant at pixel pitches 1.6mm and below while packaged versions will remain dominate at 1.7mm and above.
CoG is garnering significant interest from large and powerful LCD panel manufacturers who are motivated to leverage their manufacturing expertise and existing fabs with significant investment in R&D to focus on a glass backplane, which has great potential to drive manufacturing costs down to spur widespread adoption. To date, pilot production is very limited but expected to ramp over the next few years, driven by Pro AV adoption.